Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DC0011/05-TI900-0.12 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Other Related Documents | Die-Cut Tolerence Guide | |
| Product Training Modules | Thermal Interface Product Selection | |
| MSDS Material Safety Datasheet | Ti900 MSDS | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Ti900 | |
| Usage | TO-220 | |
| Shape | Rectangle | |
| Outline | 17.45mm x 14.27mm | |
| Thickness | 0.0050" (0.127mm) | |
| Material | Silicone | |
| Adhesive | - | |
| Backing, Carrier | Viscose | |
| Color | White | |
| Thermal Resistivity | - | |
| Thermal Conductivity | 1.8 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DC0011/05-TI900-0.12 | |
| Related Links | DC0011/05-, DC0011/05-TI900-0.12 Datasheet, t-Global Technology Distributor | |
![]() | EXB-14V123JX | RES ARRAY 2 RES 12K OHM 0302 | datasheet.pdf | |
![]() | 4828-3004-CP | CONN IC DIP SOCKET 28POS TIN | datasheet.pdf | |
![]() | M38869FFAGP#U0 | IC MCU 8BIT 60KB FLASH 80QFP | datasheet.pdf | |
![]() | 333-012-521-202 | CARDEDGE 12POS DL .156 GREEN PCB | datasheet.pdf | |
![]() | MTP3H-E6-C | MULTIPLE TIE PLATE | datasheet.pdf | |
![]() | GTC030G-28-9P | CONN RCPT 12POS PANEL MNT W/PINS | datasheet.pdf | |
![]() | 1744036-4 | 04P ECONOMY POWER .200 CL HSG | datasheet.pdf | |
![]() | MI-J60-IZ-F3 | CONVERT DC/DC 270VIN 5VOUT 25W | datasheet.pdf | |
![]() | IULK1-1REC4-32874-1 | CIRCUIT BREAKER MAG-HYDR LEVER | datasheet.pdf | |
![]() | RCG040233K0JNED | RES SMD 33K OHM 5% 1/16W 0402 | datasheet.pdf | |
![]() | ATS-07A-79-C1-R0 | HEATSINK 30X30X10MM R-TAB | datasheet.pdf | |
![]() | GDT5R531 | CAP TRIM 1-5.5PF 250V SURF MOUNT | datasheet.pdf |