Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-DF1BZ-26DP-2.5DS | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Wire-to-Board Connector | |
Standard Package | 100 | |
Category | Connectors, Interconnects | |
Family | Rectangular Connectors - Headers, Male Pins | |
Series | DF1B | |
Packaging | Bulk | |
Contact Type | Male Pin | |
Connector Type | Header, Shrouded | |
Number of Positions | 26 | |
Number of Positions Loaded | All | |
Pitch | 0.098" (2.50mm) | |
Number of Rows | 2 | |
Row Spacing | 0.098" (2.50mm) | |
Contact Mating Length | 0.177" (4.50mm) | |
Mounting Type | Through Hole, Right Angle | |
Termination | Solder | |
Fastening Type | - | |
Features | - | |
Contact Finish | Tin | |
Contact Finish Thickness | - | |
Color | White | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | DF1BZ-26DP-2.5DS | |
Related Links | DF1BZ-26, DF1BZ-26DP-2.5DS Datasheet, Hirose Electric Co Ltd Distributor |
766161823GP | RES ARRAY 15 RES 82K OHM 16SOIC | datasheet.pdf | ||
![]() | CB10JBR330 | RES .33 OHM 10W 5% CERAMIC WW | datasheet.pdf | |
![]() | RNC60J1643BSB14 | RES 164K OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | RWR82SR240FSBSL | RES 0.24 OHM 1.5W 1% AXIAL | datasheet.pdf | |
![]() | 86453-506LF | MINITEK II RA HDR | datasheet.pdf | |
![]() | ATS-08D-116-C2-R0 | HEATSINK 40X40X25MM XCUT T766 | datasheet.pdf | |
![]() | ATS-15D-43-C3-R0 | HEATSINK 25X25X10MM L-TAB T412 | datasheet.pdf | |
![]() | 66-BFF-060-1-11 | EMI FILTER | datasheet.pdf | |
![]() | 741X043221JP | RES ARRAY 2 RES 220 OHM 0404 | datasheet.pdf | |
![]() | CU1654-000 | BUTT SPLICE | datasheet.pdf | |
![]() | BFC236751563 | CAP FILM 56NF 10% 400VDC RAD | datasheet.pdf | |
![]() | XCV200E-6FG454C | IC FPGA 404 I/O 560MBGA | datasheet.pdf |