Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DF2S6.8MFS,L3F | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | ESD Protection | |
| Standard Package | 1 | |
| Category | Circuit Protection | |
| Family | TVS - Diodes | |
| Series | - | |
| Packaging | Cut Tape (CT) | |
| Type | Zener | |
| Unidirectional Channels | 1 | |
| Bidirectional Channels | - | |
| Voltage - Reverse Standoff (Typ) | 5V (Max) | |
| Voltage - Breakdown (Min) | 6V | |
| Voltage - Clamping (Max) @ Ipp | 15V (Typ) | |
| Current - Peak Pulse (10/1000µs) | 1A (8/20µs) | |
| Power - Peak Pulse | - | |
| Power Line Protection | No | |
| Applications | General Purpose | |
| Capacitance @ Frequency | 035pF @ 1MHz | |
| Operating Temperature | - | |
| Mounting Type | Surface Mount | |
| Package / Case | 2-SMD, Flat Lead | |
| Supplier Device Package | fSC | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DF2S6.8MFS,L3F | |
| Related Links | DF2S6.8, DF2S6.8MFS,L3F Datasheet, Toshiba Semiconductor & Storage Distributor | |
![]() | MCR10EZHJ150 | RES SMD 15 OHM 5% 1/8W 0805 | datasheet.pdf | |
![]() | 83500000005 | CAP FOR 5X20MM FUSES FLUSH MOUNT | datasheet.pdf | |
![]() | RMM18DRSS | CONN EDGECARD 36POS DIP .156 SLD | datasheet.pdf | |
![]() | ECW-F2394HAQ | CAP FILM 0.39UF 3% 250VDC RADIAL | datasheet.pdf | |
![]() | 8Y-20.000MAAJ-T | Crystal 20.0000MHz 30ppm 18pF 100 Ohm -20°C - 70°C Surface Mount 4-SMD, No Lead (DFN, LCC) | datasheet.pdf | |
| A40MX04-3PL84 | IC FPGA 69 I/O 84PLCC | datasheet.pdf | ||
![]() | B41505F9108M7 | CAP ALUM 1000UF 20% 100V SNAP | datasheet.pdf | |
![]() | ASCO1-6.000MHZ-EK-T3 | OSC XO 6.000MHZ CMOS SMD | datasheet.pdf | |
![]() | EBC13DCTI-S288 | CONN EDGECARD 26POS .100" | datasheet.pdf | |
![]() | ATS-02C-191-C2-R0 | HEATSINK 45X45X30MM R-TAB T766 | datasheet.pdf | |
![]() | SIT9002AC-23N18SO | OSC MEMS PROG | datasheet.pdf | |
![]() | MS27474E22F35P-LC | JT 100C 100#22D PIN RECP | datasheet.pdf |