FFF DIP306-001BLF

DIP306-001BLF picture photo
Mfg. Part Number
DIP306-001BLF
Manufacturer
Product Category
Sockets for ICs, Transistors
Brief Description
CONN IC DIP SOCKET 6POS GOLD
Datasheet Download
DIP306-001BLF.pdf
Availability of DIP306-001BLF

Available Quantity

5020 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
N/A
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of DIP306-001BLF, we specialize in FFF all series electronic components. DIP306-001BLF can be shipped within 24 hours after order. If you have any demands for DIP306-001BLF, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
DIP306-001BLF Order Process
Add Parts to RFQ form
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We reply within 24 hours
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Specifications of DIP306-001BLF
Internal Part NumberEIS-DIP306-001BLF
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)
Production Status (Lifecycle)Obsolete / Discontinued
ConditionNew & Unused, Original Sealed
PCN Obsolescence/ EOLMultiple Devices/Sockets 04/Dec/2008
Standard Package7,452
Category Connectors, Interconnects
FamilySockets for ICs, Transistors
Series-
PackagingTube
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)6 (2 x 3)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200µin (5.08µm)
Contact Material - PostBrass
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature-
Termination Post Length0.125" (3.18mm)
Material Flammability RatingUL94 V-0
Current Rating-
Contact Resistance-
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)DIP306-001BLF
Related LinksDIP306, DIP306-001BLF Datasheet, FFF Distributor
DIP306-001BLF Details Description
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