Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DM163007 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation and Demonstration Boards and Kits | |
| Series | - | |
| Main Purpose | Interface, LIN | |
| Embedded | - | |
| Utilized IC / Part | PIC16C432, PIC16C433, PIC18C658, PIC18C858 | |
| Primary Attributes | - | |
| Secondary Attributes | - | |
| Supplied Contents | Board, Cable | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DM163007 | |
| Related Links | DM16, DM163007 Datasheet, Microchip Technology Distributor | |
| AT25080A-10TU-1.8 | IC EEPROM 8KBIT 20MHZ 8TSSOP | datasheet.pdf | ||
![]() | HCS410/SN | IC CODE HOP ENCOD/TRNSPOND 8SOIC | datasheet.pdf | |
![]() | ST7MDT20J-TEB | BOARD EMULATOR ST7-EMU3 | datasheet.pdf | |
![]() | D2SW-P2L2T | SUBMINIATURE BASIC SWITCH | datasheet.pdf | |
![]() | IDT74FCT20807PYI8 | IC CLK BUFFER 1:10 166MHZ 20SSOP | datasheet.pdf | |
![]() | ATS-12F-196-C1-R0 | HEATSINK 45X45X6MM XCUT | datasheet.pdf | |
![]() | ATS-03D-137-C1-R0 | HEATSINK 25X25X10MM L-TAB | datasheet.pdf | |
![]() | ATS-15E-153-C2-R0 | HEATSINK 40X40X10MM L-TAB T766 | datasheet.pdf | |
![]() | F48-750 | XFRMR LAMINATED THRU HOLE | datasheet.pdf | |
![]() | HMC874LC3CTR-R5 | IC COMPARATOR RSPECL 16SMD | datasheet.pdf | |
![]() | ZTR500 | FIXED 2.5 AND 5 VOLT 3-TERMINAL VOLTAGE REFERENCES IC | datasheet.pdf | |
![]() | XC1718L-DD8R | Configuration Memory, 18144X1, CMOS, CDIP8 IC | datasheet.pdf |