Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DS1270Y-100 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 9 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tube | |
| Format - Memory | RAM | |
| Memory Type | NVSRAM (Non-Volatile SRAM) | |
| Memory Size | 16M (2M x 8) | |
| Speed | 100ns | |
| Interface | Parallel | |
| Voltage - Supply | 4.5 V ~ 5.5 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 36-DIP Module (0.600", 15.24mm) | |
| Supplier Device Package | 36-EDIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DS1270Y-100 | |
| Related Links | DS127, DS1270Y-100 Datasheet, Maxim Integrated Distributor | |
![]() | XC4020XL-3BG256C | IC FPGA 205 I/O 256PBGA | datasheet.pdf | |
![]() | PIC16F72-E/SS | IC MCU 8BIT 3.5KB FLASH 28SSOP | datasheet.pdf | |
![]() | 5747461-5 | D-Sub Connector Receptacle, Female Sockets 25 Position Through Hole, Right Angle Solder | datasheet.pdf | |
![]() | RBB65DHAS | CONN EDGECARD 130PS R/A .050 DIP | datasheet.pdf | |
![]() | RBC30DRTI-S734 | CONN EDGECARD 60POS DIP .100 SLD | datasheet.pdf | |
![]() | IRDC3871 | BOARD EVAL FOR IRDC3871 | datasheet.pdf | |
| 1879071-4 | RES CHAS MNT 0.1 OHM 5% 50W | datasheet.pdf | ||
![]() | B57560G145H2 | NTC THERMISTOR G560/1400K/H2 3% | datasheet.pdf | |
![]() | SF61118CY OR001 | CABLE 4COND 18AWG ORG SHLD 1000' | datasheet.pdf | |
![]() | ATS-20E-74-C2-R0 | HEATSINK 25X25X15MM R-TAB T766 | datasheet.pdf | |
![]() | T38102-11-0 | Connector Barrier Block Strip 11 Circuit 0.375" (9.53mm) | datasheet.pdf | |
![]() | 55PC1231-18-2/4/6-9CS2502 | 55PC CABLE | datasheet.pdf |