Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DS28DG02G-3C+ | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 50 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tube | |
| Format - Memory | EEPROMs - Serial | |
| Memory Type | EEPROM | |
| Memory Size | 2K (256 x 8) | |
| Speed | 2MHz | |
| Interface | SPI Serial | |
| Voltage - Supply | 2.2 V ~ 5.25 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 36-WFQFN Exposed Pad | |
| Supplier Device Package | 36-TQFN (6x6) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DS28DG02G-3C+ | |
| Related Links | DS28DG, DS28DG02G-3C+ Datasheet, Maxim Integrated Distributor | |
![]() | ECJ-UVB0J105M | CAP ARRAY 1.0UF 6.3V X5R 0504 | datasheet.pdf | |
![]() | 1083600-1 | CONN 2.4MM JACK 50 OHM SOLDER | datasheet.pdf | |
![]() | RG1005P-3090-W-T5 | RES SMD 309 OHM 0.05% 1/16W 0402 | datasheet.pdf | |
![]() | GEM25DTBD | CONN EDGECARD 50POS R/A .156 SLD | datasheet.pdf | |
![]() | 66900-930 | DUAL POL QKE II W/30AU | datasheet.pdf | |
![]() | VI-26N-MX-F2 | CONVERTER MOD DC/DC 18.5V 75W | datasheet.pdf | |
![]() | DTS26F25-24PC-LC | CONN HSG PLUG STRGHT 24POS PIN | datasheet.pdf | |
![]() | S8JX-P05024C | AC/DC CONVERTER 24V 50W | datasheet.pdf | |
![]() | 65-BFF-060-5-11 | EMI FILTER | datasheet.pdf | |
![]() | 20020302-H071B01LF | TERM BLOCK | datasheet.pdf | |
![]() | MKP383316250JKM2T0 | CAP FILM 2500VDC 0.016UF RADIAL | datasheet.pdf | |
![]() | XC8101-2PC44C | Field Programmable Gate Array, 384 CLBs, 1000 Gates, CMOS, PQCC44 IC | datasheet.pdf |