Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-DSPIC30F6013-20I/PF | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Asynchronous Stimulus Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Die/Molding Material Update 20/Jul/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | dsPIC™ 30F | |
| Packaging | Tray | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | 20 MIPS | |
| Connectivity | CAN, I²C, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, LVD, POR, PWM, WDT | |
| Number of I/O | 68 | |
| Program Memory Size | 132KB (44K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 2K x 8 | |
| RAM Size | 6K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.5 V ~ 5.5 V | |
| Data Converters | A/D 16x12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 80-TQFP | |
| Supplier Device Package | 80-TQFP (14x14) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSPIC30F6013-20I/PF | |
| Related Links | DSPIC30F6, DSPIC30F6013-20I/PF Datasheet, Microchip Technology Distributor | |
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