Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-DSPIC33EP256MU810-E/BG | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Design Resources | Development Tool Selector | |
PCN Design/Specification | dsPic33EPXXX, PIC24EPXXX Errata Doc Rev 4/Nov/2015 | |
PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
Standard Package | 184 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | dsPIC™ 33EP | |
Packaging | Tray | |
Core Processor | dsPIC | |
Core Size | 16-Bit | |
Speed | 60 MIPs | |
Connectivity | CAN, I²C, IrDA, LIN, QEI, SPI, UART/USART, USB OTG | |
Peripherals | Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT | |
Number of I/O | 83 | |
Program Memory Size | 256KB (85.5K x 24) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 12K x 16 | |
Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
Data Converters | A/D 32x10b/12b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 125°C | |
Package / Case | 121-TFBGA | |
Supplier Device Package | 121-TFBGA (10x10) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | DSPIC33EP256MU810-E/BG | |
Related Links | DSPIC33EP25, DSPIC33EP256MU810-E/BG Datasheet, Microchip Technology Distributor |
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