Microchip Technology DSPIC33FJ128GP706-I/PT
- Mfg. Part Number
- DSPIC33FJ128GP706-I/PT
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC DSC 16BIT 128KB FLASH 64TQFP
- Datasheet Download
- DSPIC33FJ128GP706-I/PT.pdf
Availability of DSPIC33FJ128GP706-I/PT
Available Quantity
10702 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 5.02000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of DSPIC33FJ128GP706-I/PT, we specialize in Microchip Technology all series electronic components. DSPIC33FJ128GP706-I/PT can be shipped within 24 hours after order. If you have any demands for DSPIC33FJ128GP706-I/PT, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- DSPIC33FJ128GP706-I/PT Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
DSPIC33FJ128GP706-I/PT
| Internal Part Number | EIS-DSPIC33FJ128GP706-I/PT | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | dsPIC33F DMAC Introduction to dsPIC33F Architecture Part 1 Asynchronous Stimulus Introduction to dsPIC33F Architecture Part 2 Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| Featured Product | PIC24FJ/33FJ MCUs & dsPIC® DSCs | |
| PCN Design/Specification | TQFP-64L Palladium Copper Wire 11/Oct/2013 | |
| PCN Assembly/Origin | Qualification Lead-Frame 03/Jun/2014 Revision with Qualification Report 22/Aug/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | dsPIC™ 33F | |
| Packaging | Tray | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | 40 MIPs | |
| Connectivity | CAN, I²C, IrDA, LIN, SPI, UART/USART | |
| Peripherals | AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | |
| Number of I/O | 53 | |
| Program Memory Size | 128KB (128K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 16K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 18x10b/12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 64-TQFP | |
| Supplier Device Package | 64-TQFP (10x10) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSPIC33FJ128GP706-I/PT | |
| Related Links | DSPIC33FJ12, DSPIC33FJ128GP706-I/PT Datasheet, Microchip Technology Distributor | |
DSPIC33FJ128GP706-I/PT Details Description
Related parts for DSPIC33FJ128GP706-I/PT
 | 1110-1R0M | FIXED IND 1UH 9A 3 MOHM TH | datasheet.pdf | |
 | 273I,AL | BOX ABS ALMOND 6.88"L X 4.88"W | datasheet.pdf | |
 | 5015914011 | CONN RCPT 40POS VERT DUAL SMD | datasheet.pdf | |
 | 0209001.MXP | FUSE GLASS 1A 350VAC 2AG | datasheet.pdf | |
 | FDMC6675BZ | MOSFET P-CH 30V 9.5A POWER33 | datasheet.pdf | |
 | FXO-PC536R-155.52 | OSC XO 155.52MHZ LVPECL SMD | datasheet.pdf | |
 | CC15-2405SFP-E | CONV DC/DC 15W 24V 5V 3A PCB | datasheet.pdf | |
 | CRCW20103K92FKEFHP | RES SMD 3.92K OHM 1% 1W 2010 | datasheet.pdf | |
| CMF20270R00GNRE | RES 270 OHM 1W 2% AXIAL | datasheet.pdf | |
 | MS-SF4BC-3 | SIDE UTLTY MNTNG BRCKT 4 PC | datasheet.pdf | |
| 1.5KE12C-B | TVS DIODE 10.2VWM 17.54VC AXIAL | datasheet.pdf | |
| TV07DZ-25-187SB-S35 | HD 38999 187C 187#23 SKT RECP | datasheet.pdf |