Microchip Technology DSPIC33FJ128GP708-I/PT
- Mfg. Part Number
- DSPIC33FJ128GP708-I/PT
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC DSC 16BIT 128KB FLASH 80TQFP
- Datasheet Download
- DSPIC33FJ128GP708-I/PT.pdf
Availability of DSPIC33FJ128GP708-I/PT
Available Quantity
5268 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 5.36000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of DSPIC33FJ128GP708-I/PT, we specialize in Microchip Technology all series electronic components. DSPIC33FJ128GP708-I/PT can be shipped within 24 hours after order. If you have any demands for DSPIC33FJ128GP708-I/PT, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- DSPIC33FJ128GP708-I/PT Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
DSPIC33FJ128GP708-I/PT
| Internal Part Number | EIS-DSPIC33FJ128GP708-I/PT | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Introduction to dsPIC33F Architecture Part 1 Asynchronous Stimulus Introduction to dsPIC33F Architecture Part 2 Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| Featured Product | PIC24FJ/33FJ MCUs & dsPIC® DSCs | |
| PCN Design/Specification | Palladium Coated Copper Bond Wire 21/Oct/2013 | |
| PCN Assembly/Origin | Qualification Lead-Frame Paddle 20/Oct/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 119 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | dsPIC™ 33F | |
| Packaging | Tray | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | 40 MIPs | |
| Connectivity | CAN, I²C, IrDA, LIN, SPI, UART/USART | |
| Peripherals | AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | |
| Number of I/O | 69 | |
| Program Memory Size | 128KB (128K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 16K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 24x10b/12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 80-TQFP | |
| Supplier Device Package | 80-TQFP (12x12) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSPIC33FJ128GP708-I/PT | |
| Related Links | DSPIC33FJ12, DSPIC33FJ128GP708-I/PT Datasheet, Microchip Technology Distributor | |
DSPIC33FJ128GP708-I/PT Details Description
Related parts for DSPIC33FJ128GP708-I/PT
 | LTC1456CN8#PBF | IC D/A CONV 12BIT R-R 8-DIP | datasheet.pdf | |
 | CD17FD301JO3F | CAP MICA 300PF 5% 500V RADIAL | datasheet.pdf | |
.jpg) | REC5-243.3SRW/H4/C/M | CONV DC/DC 5W 18-36VIN 3.3VOUT | datasheet.pdf | |
 | CA08COME28-22SBF80 | CONN PLUG 6POS RT ANG W/SCKTS | datasheet.pdf | |
| KPT02E16-26SA71 | CONN RCPT 26POS W/SKT BOX | datasheet.pdf | |
| CRCW121817R8FKEK | RES SMD 17.8 OHM 1% 1W 1218 | datasheet.pdf | |
 | K222J15C0GF5UH5 | CAP CER 2200PF 50V NP0 RADIAL | datasheet.pdf | |
 | RN50E3090BRSL | RES 309 OHM 1/20W .1% AXIAL | datasheet.pdf | |
| M39003/01-7286H | CAP TANT 4.7UF 5% 75V AXIAL | datasheet.pdf | |
 | C927U221KYYDCAWL20 | CAP CER 220PF 400VAC Y5P RADIAL | datasheet.pdf | |
-Taiyo-Yuden-.jpg) | TMK212BJ224KGHT | CAP CER 0.22UF 25V X5R 0805 | datasheet.pdf | |
| DAMMC15PJA101 | D-Sub Connector Plug, Male Pins 15 Position Through Hole, Right Angle Solder | datasheet.pdf |