Microchip Technology DSPIC33FJ32GS606-I/PT
- Mfg. Part Number
- DSPIC33FJ32GS606-I/PT
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC DSC 16BIT 32KB FLASH 64TQFP
- Datasheet Download
- DSPIC33FJ32GS606-I/PT.pdf
Availability of DSPIC33FJ32GS606-I/PT
Available Quantity
5244 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 3.84000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of DSPIC33FJ32GS606-I/PT, we specialize in Microchip Technology all series electronic components. DSPIC33FJ32GS606-I/PT can be shipped within 24 hours after order. If you have any demands for DSPIC33FJ32GS606-I/PT, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- DSPIC33FJ32GS606-I/PT Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
DSPIC33FJ32GS606-I/PT
| Internal Part Number | EIS-DSPIC33FJ32GS606-I/PT | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Interleaved Power Factor Correction Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| Featured Product | SMPS & Digital Power Conversion Solutions PIC24FJ/33FJ MCUs & dsPIC® DSCs dsPIC® "GS" DSCs | |
| PCN Design/Specification | TQFP-64L Palladium Copper Wire 11/Oct/2013 DSPIC33FJyyGS Datasheet Update 17/Jul/2014 Errata Update 22/Oct/2014 | |
| PCN Assembly/Origin | Qualification Lead-Frame 03/Jun/2014 Revision with Qualification Report 22/Aug/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | dsPIC™ 33F | |
| Packaging | Tray | |
| Core Processor | dsPIC | |
| Core Size | 16-Bit | |
| Speed | 40 MIPs | |
| Connectivity | I²C, IrDA, LIN, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, QEI, POR, PWM, WDT | |
| Number of I/O | 58 | |
| Program Memory Size | 32KB (32K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 4K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 16x10b; D/A 1x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 64-TQFP | |
| Supplier Device Package | 64-TQFP (10x10) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | DSPIC33FJ32GS606-I/PT | |
| Related Links | DSPIC33FJ3, DSPIC33FJ32GS606-I/PT Datasheet, Microchip Technology Distributor | |
DSPIC33FJ32GS606-I/PT Details Description
Related parts for DSPIC33FJ32GS606-I/PT
 | AD5428YRUZ-REEL | IC DAC 8BIT MULTIPLYING 20TSSOP | datasheet.pdf | |
 | HLEM6R-1RLF | CONN FFC FPC TOP 6POS 1.25MM R/A | datasheet.pdf | |
 | RT0603CRD073K6L | RES SMD 3.6KOHM 0.25% 1/10W 0603 | datasheet.pdf | |
| PF527 | BOARD LEVEL HEAT SINK | datasheet.pdf | |
 | XC3S200A-4FGG320I | IC FPGA 248 I/O 320FBGA | datasheet.pdf | |
 | 2299110 | CABLE 50POS SOCKET-SOCKET 1.5M | datasheet.pdf | |
 | VI-20L-IX-F2 | CONVERTER MOD DC/DC 28V 75W | datasheet.pdf | |
| VE-23Z-MU-F3 | CONVERTER MOD DC/DC 2V 80W | datasheet.pdf | |
| RWR80N25R5FRRSL | RES 25.5 OHM 2W 1% WW AXIAL | datasheet.pdf | |
 | DE03S2412A | DCDC CONVERTER 12VOUT 3W | datasheet.pdf | |
| 09300241298 | CONN BASE SIDE ENTRY SZ6B PG21 | datasheet.pdf | |
| 0011390022 | GUARD BASE ASSY | datasheet.pdf |