Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-E3Z-D82-G2SHW-P2 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Devices Nameplate May/2015 | |
Standard Package | 1 | |
Category | Sensors, Transducers | |
Family | Optical Sensors - Photoelectric, Industrial | |
Series | E3Z | |
Sensing Method | Reflective, Diffuse | |
Sensing Distance | 39.370" (1m) | |
Voltage - Supply | 12 V ~ 24 V | |
Response Time | 1ms | |
Output Configuration | PNP - Dark-ON/Light-ON - Selectable | |
Connection Method | Cable | |
Ingress Protection | IEC IP67 | |
Cable Length | * | |
Light Source | Infrared (860nm) | |
Adjustment Type | Single-Turn | |
Operating Temperature | -25°C ~ 55°C | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | E3Z-D82-G2SHW-P2 | |
Related Links | E3Z-D82-, E3Z-D82-G2SHW-P2 Datasheet, Omron Automation & Safety Distributor |
![]() | OPA2111KPG4 | IC OPAMP GP 2MHZ 8DIP | datasheet.pdf | |
![]() | CRT1206-DW-4751ELF | RES SMD 4.75K OHM 0.5% 1/8W 1206 | datasheet.pdf | |
![]() | RNC50J1331BRBSL | RES 1.33K OHM 1/10W .1% AXIAL | datasheet.pdf | |
![]() | RNC55H1003DSR36 | RES 100K OHM 1/8W .5% AXIAL | datasheet.pdf | |
![]() | EXD470SMI | ANT TWO-WAY 470-490MHZ 1/4W SMI | datasheet.pdf | |
![]() | CMF701R0000JKEK | RES 1 OHM 1.75W 5% AXIAL | datasheet.pdf | |
![]() | PM1812-821J-RC | FIXED IND 820UH 30MA 35 OHM SMD | datasheet.pdf | |
![]() | 310-83-161-41-001101 | Connector Socket 61 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | 801-87-008-30-002101 | Connector Socket 8 Position 0.100" (2.54mm) Gold Surface Mount | datasheet.pdf | |
![]() | CN0966B14S07PN-040 | 26500 7C 7#16 P TH PLUG SS LC | datasheet.pdf | |
![]() | AZV3002S-13 | IC COMPARATOR 8SOIC | datasheet.pdf | |
![]() | LDB211G6020C-001 | Chip Multilayer Hybrid Baluns | datasheet.pdf |