Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-EP1K10TI100-2N | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Three Reasons to Use FPGA's in Industrial Designs | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 90 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | ACEX-1K® | |
Number of LABs/CLBs | 72 | |
Number of Logic Elements/Cells | 576 | |
Total RAM Bits | 12288 | |
Number of I/O | 66 | |
Number of Gates | 56000 | |
Voltage - Supply | 2.375 V ~ 2.625 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 100-TQFP | |
Supplier Device Package | 100-TQFP (14x14) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | EP1K10TI100-2N | |
Related Links | EP1K10T, EP1K10TI100-2N Datasheet, Alt Distributor |
![]() | 9T12062A4643DBHFT | RES SMD 464K OHM 0.5% 1/8W 1206 | datasheet.pdf | |
![]() | RS02B900R0FS70 | RES 900 OHM 3W 1% WW AXIAL | datasheet.pdf | |
![]() | 5HFP 2.5-R | FUSE CERAMIC 2.5A 250VAC 5X20MM | datasheet.pdf | |
![]() | AHA226M63E16B-F | CAP ALUM 22UF 20% 63V SMD | datasheet.pdf | |
![]() | 0190270036 | KRIMPING DIE (ATP-AA-110-E2) | datasheet.pdf | |
![]() | M55342H03B31B6RWS | RES SMD 31.6K OHM 0.1% 1/5W 1005 | datasheet.pdf | |
![]() | 40164-0043 | SAFETY MAT 750X1800MM | datasheet.pdf | |
![]() | 8N3SV75LC-0065CDI8 | IC OSC VCXO 212.5MHZ 6-CLCC | datasheet.pdf | |
![]() | TSR1W-6A | 3/4" RACEWAY 6' WHITE | datasheet.pdf | |
![]() | EL 1 | DIODE GEN PURP 400V 1.5A AXIAL | datasheet.pdf | |
![]() | 1621581 | SF-20KP023 | datasheet.pdf | |
![]() | A10421807R26 | CONN BARRIER STRIP 18CIRC .325 | datasheet.pdf |