Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-EP1S10F672C7N | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Three Reasons to Use FPGA's in Industrial Designs | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 20 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Stratix® | |
| Number of LABs/CLBs | 1057 | |
| Number of Logic Elements/Cells | 10570 | |
| Total RAM Bits | 920448 | |
| Number of I/O | 345 | |
| Number of Gates | - | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 672-BBGA | |
| Supplier Device Package | 672-FBGA (27x27) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | EP1S10F672C7N | |
| Related Links | EP1S10, EP1S10F672C7N Datasheet, Alt Distributor | |
![]() | MDEV-900-HP3-PPS-RS232 | KIT MASTER 900MHZ HP-3 SIP RS232 | datasheet.pdf | |
![]() | FDG312P | MOSFET P-CH 20V 1.2A SC70-6 | datasheet.pdf | |
![]() | LM336DT | IC VREF SHUNT 2.49V 8SO | datasheet.pdf | |
![]() | WW12FT4R99 | RES 4.99 OHM 0.4W 1% AXIAL | datasheet.pdf | |
![]() | CB3JB36R0 | RES 36 OHM 3W 5% CERAMIC WW | datasheet.pdf | |
![]() | SN74LS266DG4 | IC GATE XNOR 4CH 2-INP 14-SOIC | datasheet.pdf | |
![]() | 7211P4DZBE | SWITCH TOGGLE SP3T 0.4VA 20V | datasheet.pdf | |
![]() | ATS-11B-10-C3-R0 | HEATSINK 45X45X25MM XCUT T412 | datasheet.pdf | |
![]() | KJB0T23F53PEL | CONN HSG RCPT 53POS WALL MNT PIN | datasheet.pdf | |
![]() | 992247-1 | CIRCUIT BREAKER, MAGNETIC, INSTA | datasheet.pdf | |
![]() | 97-3101A24-28PX | AB 24C 24#16 PIN RECP | datasheet.pdf |