Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-EP2S60F484C3N | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Three Reasons to Use FPGA's in Industrial Designs | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 60 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | Stratix® II | |
Number of LABs/CLBs | 3022 | |
Number of Logic Elements/Cells | 60440 | |
Total RAM Bits | 2544192 | |
Number of I/O | 334 | |
Number of Gates | - | |
Voltage - Supply | 1.15 V ~ 1.25 V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 484-BBGA, FCBGA | |
Supplier Device Package | 484-FBGA (23x23) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | EP2S60F484C3N | |
Related Links | EP2S60, EP2S60F484C3N Datasheet, Alt Distributor |
![]() | HQCCHA390GAT9A | CAP CER 39PF 3KV NP0 2325 | datasheet.pdf | |
![]() | RMCF2010JT240R | RES SMD 240 OHM 5% 3/4W 2010 | datasheet.pdf | |
![]() | MCR25JZHF5902 | RES SMD 59K OHM 1% 1/4W 1210 | datasheet.pdf | |
![]() | 1-1879522-8 | RES SMD 200K OHM 1% 1W 2010 | datasheet.pdf | |
![]() | 222K174-3/42-0 | BOOT MOLDED | datasheet.pdf | |
![]() | 43764-1812 | UNIVERSAL MAT TRIM KIT 18"X12" | datasheet.pdf | |
![]() | Y1624100R000A9R | RES SMD 100 OHM 0.05% 1/5W 0805 | datasheet.pdf | |
![]() | 09195407324740 | CONN HEADER 40POS T/H | datasheet.pdf | |
![]() | FROVRA12X4YL | CABLE DUCT VERT | datasheet.pdf | |
![]() | ATS-04F-90-C3-R0 | HEATSINK 35X35X35MM R-TAB T412 | datasheet.pdf | |
![]() | M2S060TS-FCS325I | IC FPGA SOC 60K LUTS | datasheet.pdf | |
![]() | TLE8264EXUMA2 | IC SYSTEM BASIS CHIP DSO-36 | datasheet.pdf |