Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-EP3SE50F484I4 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 60 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | Stratix® III E | |
Number of LABs/CLBs | 1900 | |
Number of Logic Elements/Cells | 47500 | |
Total RAM Bits | 5760000 | |
Number of I/O | 296 | |
Number of Gates | - | |
Voltage - Supply | 0.86 V ~ 1.15 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 484-BBGA, FCBGA | |
Supplier Device Package | 484-FBGA (23x23) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | EP3SE50F484I4 | |
Related Links | EP3SE5, EP3SE50F484I4 Datasheet, Alt Distributor |
![]() | LM393PSR | IC DIFF COMPARATOR DUAL 8SO | datasheet.pdf | |
![]() | 182R30 | XFRMR TOROIDAL 500VA CHAS MOUNT | datasheet.pdf | |
![]() | LK2125R18K-T | FIXED IND 180NH 270MA 250 MOHM | datasheet.pdf | |
![]() | GSM30DTBT | CONN EDGECARD 60POS R/A .156 SLD | datasheet.pdf | |
![]() | RBA50DTMD-S664 | CONN EDGECARD 100PS R/A .125 SLD | datasheet.pdf | |
![]() | QSW-100-300 | QUICK SHRINK WRAP 100MMX300MM | datasheet.pdf | |
![]() | MCR25JZHF22R1 | RES SMD 22.1 OHM 1% 1/4W 1210 | datasheet.pdf | |
![]() | 1-1625865-4 | RES SMD 4.99 OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | VE-B4T-IY-F3 | CONVERTER MOD DC/DC 6.5V 50W | datasheet.pdf | |
![]() | RNR55J1183BRB14 | RES 118K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | FR6RMBEIA | CABLE DUCT BRACKET | datasheet.pdf | |
![]() | ADJ13048 | ADJ(DJ) RELAY(FLUX 1C 2-COIL LAT | datasheet.pdf |