Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-EVB-LAN9355 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | EVB-LAN9355 Schematics EVB-LAN9355 BOM EVB-LAN9355 Gerber Files Development Tool Selector | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation and Demonstration Boards and Kits | |
| Series | - | |
| Main Purpose | Interface, Ethernet | |
| Embedded | - | |
| Utilized IC / Part | LAN9355 | |
| Primary Attributes | 3-Channel (Triple) | |
| Secondary Attributes | - | |
| Supplied Contents | Board | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | EVB-LAN9355 | |
| Related Links | EVB-L, EVB-LAN9355 Datasheet, Microchip Technology Distributor | |
![]() | RBM18DCWN | CONN EDGECARD 36POS DIP .156 SLD | datasheet.pdf | |
![]() | CAP013DG | IC CAP DISCHRG 1000V 750NF 8SOIC | datasheet.pdf | |
![]() | 1-1437418-9 | CONN BARRIER BLOCK COVER 7POS | datasheet.pdf | |
![]() | Z8F011APH020EG2156 | IC ENCORE MCU 1K FLASH 20DIP | datasheet.pdf | |
![]() | TMDSEVM6618LXE | EVAL MOD | datasheet.pdf | |
![]() | ATS-03B-91-C1-R0 | HEATSINK 40X40X10MM R-TAB | datasheet.pdf | |
![]() | ATS-14E-169-C2-R0 | HEATSINK 30X30X10MM R-TAB T766 | datasheet.pdf | |
![]() | 2420/33 YL-1000 | ULTRA-FLEX FEP 33 AWG 1000 FT YL | datasheet.pdf | |
![]() | CRCW120675K0JNEB | RES SMD 75K OHM 5% 1/4W 1206 | datasheet.pdf | |
![]() | VJ0603D2R1DLCAC | CAP CER 2.1PF 200V NP0 0603 | datasheet.pdf | |
![]() | 10128349-101LF | CONN HEADER | datasheet.pdf | |
![]() | BACC63BV20B16S7 | 26500 16C 16#16 S RECP SS WC | datasheet.pdf |