Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-FGG.1B.314.ZLD | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Circular Connectors | |
Series | 1B | |
Packaging | Bulk | |
Connector Type | Insert, Male Pins | |
Number of Positions | 14 | |
Shell Size - Insert | 314 | |
Shell Size, MIL | - | |
Mounting Type | - | |
Termination | Solder | |
Fastening Type | - | |
Orientation | G | |
Ingress Protection | IP50 - Dust Protected | |
Shell Material, Finish | - | |
Contact Finish | Gold | |
Features | Insert Only, Requires Shell, Shielded | |
Contact Finish Thickness | 39µin (1.00µm) | |
Current Rating | 2A | |
Voltage - Rated | - | |
Operating Temperature | - | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | FGG.1B.314.ZLD | |
Related Links | FGG.1B., FGG.1B.314.ZLD Datasheet, LEMO Distributor |
![]() | SM6T15AHE3/52 | TVS DIODE 12.8VWM 21.2VC SMB | datasheet.pdf | |
![]() | CPF0805B25KE1 | RES SMD 25K OHM 0.1% 1/10W 0805 | datasheet.pdf | |
![]() | EVFL375ER470JE | RES CHAS MNT 470 OHM 5% 700W | datasheet.pdf | |
![]() | CMF504M4600FLEK | RES 4.46M OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | HFMD1485 | MODULAR FLANGE DISC ENCL | datasheet.pdf | |
![]() | M2S025-1VFG400I | IC FPGA SOC 25K LUTS 400VFBGA | datasheet.pdf | |
![]() | 95648-115HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | ATS-13E-106-C1-R1 | HEATSINK 45X40X12.7MM XCUT | datasheet.pdf | |
![]() | 59105-1-S-00-0 | REED SENSORS | datasheet.pdf | |
![]() | KJB7T23F55BC | CONN HSG RCPT 55POS JAM NUT SKT | datasheet.pdf | |
![]() | 222K132-25-CS-2065-0 | MOLDED PARTS | datasheet.pdf | |
![]() | 1426049-2 | HD INDL NON-AMP APPLI | datasheet.pdf |