Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-FSI-130-10-L-D-E-AD | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
Series | FSI | |
Packaging | Bulk | |
Connector Type | Stacking Compression | |
Number of Positions | 60 | |
Pitch | 0.039" (1.00mm) | |
Number of Rows | 2 | |
Mounting Type | Surface Mount | |
Features | Board Guide | |
Contact Finish | Gold | |
Contact Finish Thickness | 10µin (0.25µm) | |
Mated Stacking Heights | - | |
Height Above Board | 0.394" (10.00mm) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | FSI-130-10-L-D-E-AD | |
Related Links | FSI-130-1, FSI-130-10-L-D-E-AD Datasheet, Samtec, Inc. Distributor |
![]() | CR3-KIT | RESISTOR KIT 10-1M 1/8W 12200PCS | datasheet.pdf | |
![]() | XCV200-4BG256I | IC FPGA 180 I/O 256PBGA | datasheet.pdf | |
![]() | DU6629-470M | FIXED IND 47UH 500MA 640 MOHM | datasheet.pdf | |
![]() | ATMEGA16-16MJ | IC MCU 8BIT 16KB FLASH 44VQFN | datasheet.pdf | |
![]() | 0001.2508.PT | FUSE CERAMIC 2.5A 250VAC 300VDC | datasheet.pdf | |
![]() | RT1206DRE07976KL | RES SMD 976K OHM 0.5% 1/4W 1206 | datasheet.pdf | |
![]() | LM3S9L97-IQC80-C1 | IC MCU 32BIT 128KB FLASH 100LQFP | datasheet.pdf | |
![]() | CL05B152JB5NNNC | CAP CER 1500PF 50V X7R 0402 | datasheet.pdf | |
![]() | MMBZ5238C-G3-18 | DIODE ZENER 8.7V 225MW SOT23-3 | datasheet.pdf | |
![]() | ADUM3151BRSZ-RL7 | DGTL ISO 3.75KV 7CH SPI 20SSOP | datasheet.pdf | |
![]() | MHQ0402P2N9BT000 | FIXED IND 2.9NH 200MA 400 MOHM | datasheet.pdf | |
![]() | 10AS066K2F35E2LG | IC SOC FPGA 588 I/O 1152FBGA | datasheet.pdf |