Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-H200X165H2T-2 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Cables, Wires - Management | |
| Family | Labels, Labeling | |
| Series | - | |
| Packaging | 250 per Roll | |
| Label Type | Heat Shrinkable, Two-Sided | |
| Label Size | 2.00" x 1.65" (50.8mm x 41.9mm) | |
| Color | Yellow | |
| Material | Polyolefin | |
| For Use With/Related Products | Thermal Transfer Printer | |
| Operating Temperature | -55°C ~ 135°C | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | H200X165H2T-2 | |
| Related Links | H200X1, H200X165H2T-2 Datasheet, Panduit Distributor | |
![]() | 1025-96K | FIXED IND 120NH 1.3A 90 MOHM TH | datasheet.pdf | |
![]() | MC74AC273NG | IC D-TYPE POS TRG SNGL 20DIP | datasheet.pdf | |
![]() | LD1086V80 | IC REG LDO 8V 1.5A TO220AB | datasheet.pdf | |
![]() | CRCW020182K5FNED | RES SMD 82.5K OHM 1% 1/20W 0201 | datasheet.pdf | |
![]() | 70T3319S133BFI | IC SRAM 4.5MBIT 133MHZ 208CABGA | datasheet.pdf | |
![]() | C1206C183K1RACTU | CAP CER 0.018UF 100V X7R 1206 | datasheet.pdf | |
![]() | VI-2N0-IU-F4 | CONVERTER MOD DC/DC 5V 200W | datasheet.pdf | |
![]() | RNC55H1050FPB14 | RES 105 OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | 800-10-031-30-001101 | CONN HDR 31POS 0.100 SMD | datasheet.pdf | |
![]() | 133-3901-401 | CONN ADAPT JACK-JACK MCX 50OHM | datasheet.pdf | |
![]() | ATS-13G-115-C2-R0 | HEATSINK 40X40X20MM XCUT T766 | datasheet.pdf | |
![]() | XC3S400-4FG456EGQ | IC FPGA 489 I/O 676FCBGA | datasheet.pdf |