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Renesas Electronics America HD64F3062BFI25-TR

HD64F3062BFI25-TR picture photo
Mfg. Part Number
HD64F3062BFI25-TR
Manufacturer
Product Category
Embedded - Microcontrollers
Brief Description
IC MCU 16BIT 128KB FLASH 100QFP
Datasheet Download
HD64F3062BFI25-TR.pdf
Availability of HD64F3062BFI25-TR

Available Quantity

5020 Pieces

Can ship today

Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

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EIS Components is the stocking Distributor of HD64F3062BFI25-TR, we specialize in Renesas Electronics America all series electronic components. HD64F3062BFI25-TR can be shipped within 24 hours after order. If you have any demands for HD64F3062BFI25-TR, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
HD64F3062BFI25-TR Order Process
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Specifications of HD64F3062BFI25-TR
Internal Part NumberEIS-HD64F3062BFI25-TR
Lead Free Status / RoHS StatusContains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
Production Status (Lifecycle)Obsolete / Discontinued
ConditionNew & Unused, Original Sealed
Design ResourcesDevelopment Tool Selector
Standard Package1
Category Integrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
SeriesH8® H8/300H
PackagingTape & Reel (TR)
Core ProcessorH8/300H
Core Size16-Bit
Speed25MHz
ConnectivitySCI, SmartCard
PeripheralsDMA, POR, PWM, WDT
Number of I/O70
Program Memory Size128KB (128K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size4K x 8
Voltage - Supply (Vcc/Vdd)4.5 V ~ 5.5 V
Data ConvertersA/D 8x10b; D/A 2x8b
Oscillator TypeInternal
Operating Temperature-20°C ~ 75°C
Package / Case100-BFQFP
Supplier Device Package100-QFP (14x14)
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)HD64F3062BFI25-TR
Related LinksHD64F306, HD64F3062BFI25-TR Datasheet, Renesas Electronics America Distributor
HD64F3062BFI25-TR Details Description
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