Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-HD64F3670FXV | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | R8C Product Overview Electromagnetic Noise Reduction Techniques Part 1 Digital to Analog Converter Part 1 Digital to Analog Converter Part 2 | |
Design Resources | Development Tool Selector | |
Standard Package | 1 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | H8® H8/300H Tiny | |
Packaging | Tray | |
Core Processor | H8/300H | |
Core Size | 16-Bit | |
Speed | 16MHz | |
Connectivity | SCI | |
Peripherals | PWM, WDT | |
Number of I/O | 26 | |
Program Memory Size | 8KB (8K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 2K x 8 | |
Voltage - Supply (Vcc/Vdd) | 3 V ~ 5.5 V | |
Data Converters | A/D 4x10b | |
Oscillator Type | External | |
Operating Temperature | -20°C ~ 75°C | |
Package / Case | 48-LQFP | |
Supplier Device Package | 48-LQFP (10x10) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | HD64F3670FXV | |
Related Links | HD64F3, HD64F3670FXV Datasheet, Renesas Electronics America Distributor |
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