Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-HDAF-23-08.0-S-13-2 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Series | HD Mezz™ HDAF | |
| Packaging | Tray | |
| Connector Type | High Density Array, Female | |
| Number of Positions | 299 | |
| Pitch | 0.047" (1.20mm) | |
| Number of Rows | 13 | |
| Mounting Type | Surface Mount | |
| Features | Board Guide | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 30µin (0.76µm) | |
| Mated Stacking Heights | 20mm, 25mm | |
| Height Above Board | 0.414" (10.51mm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | HDAF-23-08.0-S-13-2 | |
| Related Links | HDAF-23-0, HDAF-23-08.0-S-13-2 Datasheet, Samtec, Inc. Distributor | |
![]() | TNPW2512100KBEEY | RES SMD 100K OHM 0.1% 1/2W 2512 | datasheet.pdf | |
![]() | RMCF0805FG56K2 | RES SMD 56.2K OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | MMA9550LT | IC ACCEL 3-AXIS W/32B MCU 16LGA | datasheet.pdf | |
| AXK8L60124BG | CONN HEADER FPC .4MM 60POS SMD | datasheet.pdf | ||
![]() | B43086A4475M | CAP ALUM 4.7UF 20% 350V RADIAL | datasheet.pdf | |
![]() | Z8F012AHJ020SG2156 | IC ENCORE MCU 1K FLASH 28SSOP | datasheet.pdf | |
![]() | PKG.5B.320.CYMD13 | CONN PNL MNT RCPT 20SKT CRIMP | datasheet.pdf | |
![]() | ATS-18F-201-C1-R0 | HEATSINK 50X50X12MM XCUT | datasheet.pdf | |
![]() | ATS-13D-113-C1-R0 | HEATSINK 40X40X10MM XCUT | datasheet.pdf | |
![]() | BFC237520472 | CAP FILM 4.7NF 5% 1000VDC RAD | datasheet.pdf | |
![]() | PZ3320C7BE | Loadable PLD, 10ns, 320-Cell, CMOS, PQFP160 IC | datasheet.pdf | |
![]() | MB27101KBN | HIGH FREQUENCY CERAMIC CAPACITORS | datasheet.pdf |