Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-HDAF-23-18.0-S-13-1 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
Series | HD Mezz™ HDAF | |
Packaging | Tray | |
Connector Type | High Density Array, Female | |
Number of Positions | 299 | |
Pitch | 0.047" (1.20mm) | |
Number of Rows | 13 | |
Mounting Type | Surface Mount | |
Features | Board Guide | |
Contact Finish | Gold | |
Contact Finish Thickness | 30µin (0.76µm) | |
Mated Stacking Heights | 30mm, 35mm | |
Height Above Board | 0.807" (20.51mm) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | HDAF-23-18.0-S-13-1 | |
Related Links | HDAF-23-1, HDAF-23-18.0-S-13-1 Datasheet, Samtec, Inc. Distributor |
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