Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-HDAM-11-17.0-S-13-1 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Series | HD Mezz™ HDAM | |
| Packaging | Tray | |
| Connector Type | High Density Array, Male | |
| Number of Positions | 143 | |
| Pitch | 0.047" (1.20mm) | |
| Number of Rows | 13 | |
| Mounting Type | Surface Mount | |
| Features | Board Guide | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 30µin (0.76µm) | |
| Mated Stacking Heights | 25mm, 35mm | |
| Height Above Board | 0.880" (22.35mm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | HDAM-11-17.0-S-13-1 | |
| Related Links | HDAM-11-1, HDAM-11-17.0-S-13-1 Datasheet, Samtec, Inc. Distributor | |
![]() | ERJ-3EKF2320V | RES SMD 232 OHM 1% 1/10W 0603 | datasheet.pdf | |
![]() | TPA6111A2DR | IC AMP AUDIO PWR .15W STER 8SOIC | datasheet.pdf | |
![]() | TNPU080540K2BZEN00 | RES SMD 40.2K OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | Q5-3XM-2-01-QB6IN-3 | HEATSHRINK 2"-6" BLACK | datasheet.pdf | |
![]() | 7211SDAV2KE | SWITCH TOGGLE SP3T 0.4VA 20V | datasheet.pdf | |
![]() | IPA-66-34759-3 | CIR BRKR MAG-HYDR LEVER | datasheet.pdf | |
![]() | MVU10-10FBK | VINYL INSUL BUTT SEAM RING TONGU | datasheet.pdf | |
![]() | CY14B101LA-BA25XIT | IC NVSRAM 1MBIT 25NS 48FBGA | datasheet.pdf | |
![]() | 830-10-006-30-001191 | CONN HDR 6POS 2MM SMD | datasheet.pdf | |
![]() | ATS-08A-91-C2-R0 | HEATSINK 40X40X10MM R-TAB T766 | datasheet.pdf | |
![]() | ATS-03D-176-C2-R0 | HEATSINK 35X35X15MM R-TAB T766 | datasheet.pdf | |
![]() | PT02E16-26P-002 | PT 26C 26#20 PIN PIN | datasheet.pdf |