Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-HF115AC-0.0055-AC-58 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Other Related Documents | Sil-Pad Metric Configurations | |
RoHS Information | Hi-Flow 115-AC Material Report | |
Standard Package | 100 | |
Category | Fans, Thermal Management | |
Family | Thermal - Pads, Sheets | |
Series | Hi-Flow® 115-AC | |
Usage | TO-220 | |
Shape | Rectangle | |
Outline | 19.05mm x 12.70mm | |
Thickness | 0.0055" (0.140mm) | |
Material | Phase Change Compound | |
Adhesive | Adhesive - One Side | |
Backing, Carrier | Fiberglass | |
Color | Gray | |
Thermal Resistivity | 0.35°C/W | |
Thermal Conductivity | 0.8 W/m-K | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | HF115AC-0.0055-AC-58 | |
Related Links | HF115AC-0., HF115AC-0.0055-AC-58 Datasheet, Bergquist Distributor |
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