Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-HF115AC-0.0055-AC-58 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Other Related Documents | Sil-Pad Metric Configurations | |
| RoHS Information | Hi-Flow 115-AC Material Report | |
| Standard Package | 100 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Hi-Flow® 115-AC | |
| Usage | TO-220 | |
| Shape | Rectangle | |
| Outline | 19.05mm x 12.70mm | |
| Thickness | 0.0055" (0.140mm) | |
| Material | Phase Change Compound | |
| Adhesive | Adhesive - One Side | |
| Backing, Carrier | Fiberglass | |
| Color | Gray | |
| Thermal Resistivity | 0.35°C/W | |
| Thermal Conductivity | 0.8 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | HF115AC-0.0055-AC-58 | |
| Related Links | HF115AC-0., HF115AC-0.0055-AC-58 Datasheet, Bergquist Distributor | |
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