Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-HKC02P-18-10P | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors | |
| Series | - | |
| Packaging | - | |
| Connector Type | - | |
| Number of Positions | - | |
| Shell Size - Insert | - | |
| Shell Size, MIL | - | |
| Mounting Type | - | |
| Termination | - | |
| Fastening Type | - | |
| Orientation | - | |
| Ingress Protection | - | |
| Shell Material, Finish | - | |
| Contact Finish | - | |
| Features | - | |
| Contact Finish Thickness | - | |
| Current Rating | - | |
| Voltage - Rated | - | |
| Operating Temperature | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | HKC02P-18-10P | |
| Related Links | HKC02P, HKC02P-18-10P Datasheet, Amphenol Industrial Distributor | |
![]() | MAX122AENG | IC ADC 12-BIT 333KSPS T/H 24DIP | datasheet.pdf | |
![]() | ZGP323HES2808G | IC Z8 GP MCU 8K OTP 28SOIC | datasheet.pdf | |
![]() | CD74HC08MG4 | IC GATE AND 4CH 2-INP 14-SOIC | datasheet.pdf | |
![]() | 81A1A-B28-B25L | POT 1M OHM 1W PLASTIC LINEAR | datasheet.pdf | |
![]() | RNC60H2101BSRE6 | RES 2.1K OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | RNR55K2612FMB14 | RES 26.1K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | 5HTP 500-R | FUSE CERAMIC 500MA 250VAC 5X20MM | datasheet.pdf | |
![]() | 0382190214 | OB BTS FT 8 ASY | datasheet.pdf | |
![]() | JBXFC2J07FSSDSR | CONN PLUG 7POS INLINE SKT RA | datasheet.pdf | |
![]() | ATS-01C-181-C2-R0 | HEATSINK 40X40X10MM R-TAB T766 | datasheet.pdf | |
![]() | MKP1839515161 | CAP FILM 1.5UF 1% 160VDC AXIAL | datasheet.pdf | |
![]() | 71-533722-06S | PT07C10-6S W/ PC CONTACTS | datasheet.pdf |