Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-HM2P08PDW111N9 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Millipacs Header & Receptacle 13/Feb/2014 | |
| PCN Design/Specification | HM2 Plating 20/Sept/2012 HM2 Series Copper Alloy 22/Jun/2013 | |
| PCN Packaging | Millipacs UL/CSA marking 01/July/2009 Millipacs Devices 16/Dec/2010 | |
| Standard Package | 192 | |
| Category | Connectors, Interconnects | |
| Family | Backplane Connectors - Hard Metric, Standard | |
| Series | Millipacs® | |
| Packaging | Tray | |
| Connector Type | Header, Male Pins | |
| Connector Style | B 25 | |
| Number of Positions | 175 (125 + 50 Ground) | |
| Number of Positions Loaded | All | |
| Pitch | 0.079" (2.00mm) | |
| Number of Rows | 5 + 2 | |
| Mounting Type | Through Hole | |
| Termination | Press-Fit | |
| Connector Usage | CompactPCI | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 30µin (0.76µm) | |
| Current Rating | 1.5A | |
| Voltage Rating | 750V | |
| Operating Temperature | -55°C ~ 125°C | |
| Features | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | HM2P08PDW111N9 | |
| Related Links | HM2P08P, HM2P08PDW111N9 Datasheet, FFF Distributor | |
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