Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-HM2P08PKP2L5GFL | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | HM2 Series Copper Alloy 22/Jun/2013 | |
| Standard Package | 1,152 | |
| Category | Connectors, Interconnects | |
| Family | Backplane Connectors - Hard Metric, Standard | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | HM2P08PKP2L5GFL | |
| Related Links | HM2P08P, HM2P08PKP2L5GFL Datasheet, FFF Distributor | |
![]() | ICL7135CPI-2 | IC ADC 4.5DIGIT W/BCD 28-DIP | datasheet.pdf | |
![]() | MCA12060D1912BP500 | RES SMD 19.1K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | NPTC332KFMS-RC | Connector Header 66 Position 0.100" (2.54mm) Tin Surface Mount | datasheet.pdf | |
![]() | SGH40N60UFDTU | IGBT 600V 40A 160W TO3P | datasheet.pdf | |
![]() | HM1C09D2C010EB | 10POS LOADED HM1C | datasheet.pdf | |
![]() | TLV320AIC3120IRHBT | IC CODEC AUD AMP CLASS D 32QFN | datasheet.pdf | |
![]() | 310002820001 | HERMETIC THERMOSTAT | datasheet.pdf | |
![]() | 1944440000 | BLZP 5.08/13/180F SN BK BX | datasheet.pdf | |
![]() | 10091767-C0C-70B | XCEDE LEFT 4PVH 6COL | datasheet.pdf | |
![]() | ATS-08H-172-C2-R0 | HEATSINK 30X30X25MM R-TAB T766 | datasheet.pdf | |
![]() | ATS-08D-145-C3-R0 | HEATSINK 30X30X30MM L-TAB T412 | datasheet.pdf | |
![]() | TI12015000J0G | 500 TB RIS CLA STACK | datasheet.pdf |