Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-HM2PN3PDG3N9N9 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Millipacs Header & Receptacle 13/Feb/2014 | |
| PCN Design/Specification | HM2 Series Copper Alloy 22/Jun/2013 | |
| Standard Package | 1,152 | |
| Category | Connectors, Interconnects | |
| Family | Backplane Connectors - Hard Metric, Standard | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | HM2PN3PDG3N9N9 | |
| Related Links | HM2PN3P, HM2PN3PDG3N9N9 Datasheet, FFF Distributor | |
![]() | PQ1U351M2ZPH | IC REG LDO 3.5V 0.15A SOT23-5 | datasheet.pdf | |
![]() | AR-08-HZW/TN | CONN IC DIP SOCKET 8POS GOLD | datasheet.pdf | |
![]() | SN74AHCT08DG4 | IC GATE AND 4CH 2-INP 14-SOIC | datasheet.pdf | |
![]() | OP600C | PHOTOTRNS SILCN NPN HERMETC PILL | datasheet.pdf | |
![]() | EP4CE6F17C8L | IC FPGA 179 I/O 256FBGA | datasheet.pdf | |
![]() | XA6SLX25T-3FGG484Q | IC FPGA 250 I/O 484FGGBGA | datasheet.pdf | |
![]() | CR0805-FX-2431ELF | RES SMD 2.43K OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | TNM2.5-6.5-45-2 | ROUND STANDOFF M2.5 NYLON 45MM | datasheet.pdf | |
![]() | VS-30CTQ035STRLPBF | DIODE ARRAY SCHOTTKY 35V D2PAK | datasheet.pdf | |
![]() | GLL4759-E3/97 | DIODE ZENER 62V 1W MELF DO213AB | datasheet.pdf | |
![]() | 101-100RB | RES 100 OHM 1/4W 0.1% AXIAL | datasheet.pdf | |
![]() | AIB1FA18-1SC-B30 | GT 10C 10#16 SKT RECP LINE | datasheet.pdf |