Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-HPCS3477C.B0-998972 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | CS3477/CS3487 Devices 08/Jan/2014 | |
| PCN Packaging | MSL Label Update 03/Feb/2015 | |
| Standard Package | 5 | |
| Category | Integrated Circuits (ICs) | |
| Family | Interface - Telecom | |
| Series | - | |
| Packaging | Tray | |
| Function | * | |
| Interface | Interlaken, XAUI | |
| Number of Circuits | * | |
| Voltage - Supply | * | |
| Current - Supply | * | |
| Power (Watts) | * | |
| Operating Temperature | * | |
| Mounting Type | Surface Mount | |
| Package / Case | 1024-BGA | |
| Supplier Device Package | 1024-BGA (33x33) | |
| Includes | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | HPCS3477C.B0-998972 | |
| Related Links | HPCS3477C, HPCS3477C.B0-998972 Datasheet, Inphi Corporation Distributor | |
![]() | 90759-2 | DIE SET FOR PRO-C III 22-20,18 | datasheet.pdf | |
![]() | ERJ-S08F1540V | RES SMD 154 OHM 1% 1/4W 1206 | datasheet.pdf | |
![]() | CRCW0402270RJNED | RES SMD 270 OHM 5% 1/16W 0402 | datasheet.pdf | |
![]() | APA450-BGG456I | IC FPGA 344 I/O 456PBGA | datasheet.pdf | |
![]() | 0022285054 | KK 100 HDR ASSY BKWY 5POS | datasheet.pdf | |
![]() | RNC55H10R6BSB14 | RES 10.6 OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | M83446/39-57F | FIXED IND 470UH 88MA 26 OHM SMD | datasheet.pdf | |
| 501BCA16M0000DAGR | OSC CMEMS 16.000MHZ LVCMOS SMD | datasheet.pdf | ||
![]() | UPV1C181MGD1TA | CAP ALUM 180UF 20% 16V RADIAL | datasheet.pdf | |
![]() | VJ0603D271FLAAT | CAP CER 270PF 50V NP0 0603 | datasheet.pdf | |
![]() | 97-3101A24-9SW | AB 2C 2#4 SKT RECP | datasheet.pdf | |
![]() | XCS40XL-PQ208C | IC FPGA 205 I/O 256BGA | datasheet.pdf |