Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-IS45S16160D-7TLA1 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 108 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | SDRAM | |
| Memory Size | 256M (16M x 16) | |
| Speed | 143MHz | |
| Interface | Parallel | |
| Voltage - Supply | 3 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 54-TSOP (0.400", 10.16mm Width) | |
| Supplier Device Package | 54-TSOP II | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | IS45S16160D-7TLA1 | |
| Related Links | IS45S161, IS45S16160D-7TLA1 Datasheet, ISSI, Integrated Silicon Solution Inc Distributor | |
![]() | 9C12063A3304FKHFT | RES SMD 3.3M OHM 1% 1/4W 1206 | datasheet.pdf | |
![]() | C4PXS-4036M | DIP CABLE - CDP40S/AE40M/X | datasheet.pdf | |
![]() | MCR10EZPJ200 | RES SMD 20 OHM 5% 1/8W 0805 | datasheet.pdf | |
![]() | CC2510F32RSPG3 | CC2510F32RSPG3 | datasheet.pdf | |
![]() | EP4CE10F17C6 | IC FPGA 179 I/O 256FBGA | datasheet.pdf | |
![]() | B43252A1227M | CAP ALUM 120UF 20% 160V SNAP | datasheet.pdf | |
![]() | 1290170000 | S2C-SMT 3.50/30/180G 3.5SN BK | datasheet.pdf | |
![]() | 316-83-142-41-013101 | Connector Socket 42 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
| UVY1V101MED1TD | CAP ALUM 100UF 20% 35V RADIAL | datasheet.pdf | ||
![]() | E2B-M12KS02-WP-C1 2M | SINGLE M12 SHORT PW 2M NPN NO | datasheet.pdf | |
![]() | CRCW080546K4FKTB | RES SMD 46.4K OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | 202D263-4-122-CS2542 | KIT BOOT ADAPTER | datasheet.pdf |