Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-IS61DDPB22M18A-400M3L | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 105 | |
Category | Integrated Circuits (ICs) | |
Family | Memory | |
Series | - | |
Packaging | Tray | |
Format - Memory | RAM | |
Memory Type | SRAM - Synchronous, DDR IIP | |
Memory Size | 36M (2M x 18) | |
Speed | 400MHz | |
Interface | Common I/O | |
Voltage - Supply | 1.71 V ~ 1.89 V | |
Operating Temperature | 0°C ~ 70°C | |
Package / Case | 165-LBGA | |
Supplier Device Package | 165-LFBGA (15x17) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | IS61DDPB22M18A-400M3L | |
Related Links | IS61DDPB22, IS61DDPB22M18A-400M3L Datasheet, ISSI, Integrated Silicon Solution Inc Distributor |
![]() | 322128 | CONN RING 8 AWG #10 RED AMPL-BND | datasheet.pdf | |
![]() | Z8023010PSC | IC 10MHZ Z8000 CMOS ESCC 40-DIP | datasheet.pdf | |
280616-2 | CONN HEADER 4POS R/A GOLD .156 | datasheet.pdf | ||
![]() | MC74VHC1GT125DT1G | IC BUFF/LVL SHFTR N-INV 5TSOP | datasheet.pdf | |
![]() | 2-1105101-2 | CONN CONTACT SOCKET HE/HA SRS | datasheet.pdf | |
![]() | VI-2N3-EX-F4 | CONVERTER MOD DC/DC 24V 75W | datasheet.pdf | |
![]() | 55GN01MA-TL-E | TRANS NPN BIPO 70MA 10V MCP | datasheet.pdf | |
![]() | CMF5541K700BER670 | RES 41.7K OHM 1/2W .1% AXIAL | datasheet.pdf | |
![]() | T507087074AQ | SCR INV STUD 70A 800V TO-94 | datasheet.pdf | |
![]() | ECM08DRFI | CONN EDGECARD 16POS .156" | datasheet.pdf | |
![]() | SIT3809AC-C-28EX | OSC MEMS PROG 2.8V SMD | datasheet.pdf | |
![]() | 7N-19.440MBP-T | OSC TCXO 19.440MHZ CMOS SMD | datasheet.pdf |