Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-IS61QDB22M18A-250M3L | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 105 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Synchronous, QUAD | |
| Memory Size | 36M (2M x 18) | |
| Speed | 250MHz | |
| Interface | Parallel | |
| Voltage - Supply | 1.71 V ~ 1.89 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 165-LBGA | |
| Supplier Device Package | 165-LFBGA (15x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | IS61QDB22M18A-250M3L | |
| Related Links | IS61QDB22M, IS61QDB22M18A-250M3L Datasheet, ISSI, Integrated Silicon Solution Inc Distributor | |
![]() | ERJ-S08F4642V | RES SMD 46.4K OHM 1% 1/4W 1206 | datasheet.pdf | |
![]() | ESM15DRAH | CONN EDGECARD 30POS R/A .156 SLD | datasheet.pdf | |
| 180599 | CONN WIRE PIN 8AWG STRANDED TIN | datasheet.pdf | ||
![]() | IXSH30N60C | IGBT 600V 55A 200W TO247AD | datasheet.pdf | |
| LGN2G271MELC25 | CAP ALUM 270UF 20% 400V SNAP | datasheet.pdf | ||
![]() | 61500153400 | SE SURFACE CONDITION DISC TR 2" | datasheet.pdf | |
![]() | TRR03EZPF1130 | RES SMD 113 OHM 1% 1/10W 0603 | datasheet.pdf | |
![]() | 39200-843 | CONN BOOT FOR CAT6 MOD RJ45 PLUG | datasheet.pdf | |
![]() | SIT3807AC-G-33SH | OSC MEMS PROG 2.5X2.0MM 3.3V | datasheet.pdf | |
![]() | HS25 16R F | RES CHAS MNT 16 OHM 1% 25W | datasheet.pdf | |
![]() | TV07DZ-13-32SB | HD 38999 32C 32#23 SKT RECP | datasheet.pdf | |
![]() | XCV812E-7FG900I | Virtex-E 1.8 V Extended Memory FPGA Field Programmable Gate Arrays IC | datasheet.pdf |