Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-IS61QDB22M18A-250M3L | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 105 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Synchronous, QUAD | |
| Memory Size | 36M (2M x 18) | |
| Speed | 250MHz | |
| Interface | Parallel | |
| Voltage - Supply | 1.71 V ~ 1.89 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 165-LBGA | |
| Supplier Device Package | 165-LFBGA (15x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | IS61QDB22M18A-250M3L | |
| Related Links | IS61QDB22M, IS61QDB22M18A-250M3L Datasheet, ISSI, Integrated Silicon Solution Inc Distributor | |
![]() | PSC2-1CB | HEATSINK CLIP ON BLACK TO-220 | datasheet.pdf | |
![]() | RT0603DRD07475RL | RES SMD 475 OHM 0.5% 1/10W 0603 | datasheet.pdf | |
![]() | XC6210B302MR-G | IC REG LDO 3V 0.7A SOT25 | datasheet.pdf | |
![]() | 1622343-1 | RES 187 OHM 0.6W 1% AXIAL | datasheet.pdf | |
![]() | CW01050R50JE73 | RES 50.5 OHM 10W 5% AXIAL | datasheet.pdf | |
![]() | 0015453114 | Connector Receptacle 14 Position 0.100" (2.54mm) Gold Surface Mount | datasheet.pdf | |
![]() | V27ZS60PX2855 | VARISTOR 23V 2KA DISC 20MM | datasheet.pdf | |
![]() | CMF5533K200DHR6 | RES 33.2K OHM 1/2W .5% AXIAL | datasheet.pdf | |
![]() | 600L3R0BT200T | CAP CER 3PF 200V NP0 0402 | datasheet.pdf | |
![]() | CEE2X60PF102PY4WLF | 0.050" PCI P/F CONNECTOR | datasheet.pdf | |
![]() | ATS-21G-05-C2-R0 | HEATSINK 40X40X25MM XCUT T766 | datasheet.pdf | |
![]() | ERJ-PA3D17R8V | RES SMD 17.8 OHM 0.5% 1/4W 0603 | datasheet.pdf |