Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-JBXSCFD1G10MSS1 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Cable Assemblies | |
| Family | D-Sub Cables | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | JBXSCFD1G10MSS1 | |
| Related Links | JBXSCFD, JBXSCFD1G10MSS1 Datasheet, Souriau Connection Technology Distributor | |
![]() | LP38853T-ADJ/NOPB | IC REG LDO ADJ 3A TO220-7 | datasheet.pdf | |
![]() | 1330785-1 | CONN SMA JACK STR 50 OHM SOLDER | datasheet.pdf | |
![]() | NS8JTHE3/45 | DIODE GEN PURP 600V 8A TO220AC | datasheet.pdf | |
![]() | VI-BNW-MX-F4 | CONVERTER MOD DC/DC 5.5V 75W | datasheet.pdf | |
![]() | B43231B477M | CAP ALUM 470UF 20% 315V SNAP | datasheet.pdf | |
![]() | XC7K70T-L2FBG484E | IC FPGA 185 I/O 484FCBGA | datasheet.pdf | |
![]() | FG-23742-150 | MICROPHONE | datasheet.pdf | |
![]() | 081041001300 | PMI BASE 11/16 INCAND BAY SOLDER | datasheet.pdf | |
![]() | ATS-13C-138-C2-R0 | HEATSINK 25X25X15MM L-TAB T766 | datasheet.pdf | |
![]() | TR23355100J0G | 381 TB WIR PRO 180D | datasheet.pdf | |
![]() | FXTH8705116T1 | IC SENSOR MULTICHIP XZAXIS 24QFN | datasheet.pdf | |
![]() | 9-228783-0 | FERRULE,PLATED, LEAD FREE | datasheet.pdf |