Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-KJB0T13W35SAL | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | MIL-DTL-38999 Series III, KJB | |
| Packaging | Bulk | |
| Connector Type | Receptacle for Female Contacts | |
| Number of Positions | 22 | |
| Shell Size - Insert | 13-35 | |
| Shell Size, MIL | - | |
| Contact Type | Crimp | |
| Contact Size | 22D | |
| Mounting Type | Panel Mount, Flange | |
| Fastening Type | Threaded | |
| Orientation | A | |
| Shell Material, Finish | Aluminum Alloy, Olive Drab Cadmium Plated | |
| Ingress Protection | Environment Resistant | |
| Features | - | |
| Note | Contacts Not Provided | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | KJB0T13W35SAL | |
| Related Links | KJB0T1, KJB0T13W35SAL Datasheet, ITT Cannon, LLC Distributor | |
![]() | EX64-PTQG64 | IC FPGA 41 I/O 64TQFP | datasheet.pdf | |
![]() | PWR4525WR100F | RES SMD 0.1 OHM 1% 2W 4525 | datasheet.pdf | |
![]() | SMLJ36E3/TR13 | TVS DIODE 36VWM 64.3VC SMCJ | datasheet.pdf | |
![]() | 68016-101HLF | BERGSTIK II SNGL RA | datasheet.pdf | |
![]() | 403C35E16M00000 | Crystal 16.0000MHz 30ppm 20pF 80 Ohm -20°C - 70°C Surface Mount 4-SMD, No Lead (DFN, LCC) | datasheet.pdf | |
![]() | ATS-01B-156-C3-R0 | HEATSINK 40X40X25MM L-TAB T412 | datasheet.pdf | |
![]() | ATS-07B-36-C1-R0 | HEATSINK 36.83X57.6X11.43MM | datasheet.pdf | |
![]() | YD12015000J0G | 500 TB RIS CLA 180D 1ST | datasheet.pdf | |
![]() | 0622003701 | COAX WIRE STRIPPER | datasheet.pdf | |
| HS200 68R J | RES CHAS MNT 68 OHM 5% 200W | datasheet.pdf | ||
![]() | MDM-12 | FUSE BUSS SMALL DIMENSION | datasheet.pdf | |
![]() | LDB181G9510C-110 | Chip Multilayer Hybrid Baluns | datasheet.pdf |