Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LFXP2-17E-5QN208C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Assembly/Origin | Alternate Qualified Test Site 30/Sep/2013 | |
| Standard Package | 24 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | XP2 | |
| Number of LABs/CLBs | 2125 | |
| Number of Logic Elements/Cells | 17000 | |
| Total RAM Bits | 282624 | |
| Number of I/O | 146 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 208-BFQFP | |
| Supplier Device Package | 208-PQFP (28x28) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LFXP2-17E-5QN208C | |
| Related Links | LFXP2-17, LFXP2-17E-5QN208C Datasheet, Lattice Semiconductor Corporation Distributor | |
![]() | 1786010000 | TERM BLOCK PCB 5.08MM 11POS BK | datasheet.pdf | |
![]() | XC2V6000-4FFG1152C | IC FPGA 824 I/O 1152FCBGA | datasheet.pdf | |
![]() | 821-22-043-10-000101 | CONN SPRING 43POS SNGL .137 PCB | datasheet.pdf | |
![]() | 83161312 | SNSW 10.1A 1/4"QC NONUL | datasheet.pdf | |
![]() | DFN3.66BK25 | DURA-FLEX 3.66" BLACK 25' | datasheet.pdf | |
| 09670250438 | DSUB IP 67 TOP PLASTIC HOOD 25P | datasheet.pdf | ||
![]() | RN55D1102FBSL | RES 11K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | LM95235EIMM | SENSOR TEMPERATURE SMBUS 8VSSOP | datasheet.pdf | |
![]() | 1049010000 | BLZ 7.62HP/05/180 SN BK BX | datasheet.pdf | |
![]() | A22TK-2LL-11-K01 | A22TK-2LL-11-K01 | datasheet.pdf | |
![]() | MIKROE-598 | BOARD DEV SYSTEM BIG8051 | datasheet.pdf | |
![]() | YB216CWCKW01-5C24-JB | SWITCH PUSHBUTTON SPDT 3A 125V | datasheet.pdf |