Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LFXP3C-3Q208I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | LatticeEC/P and LatticeXP Devices 25/Jul/2013 | |
| Standard Package | 24 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | XP | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 3000 | |
| Total RAM Bits | 55296 | |
| Number of I/O | 136 | |
| Number of Gates | - | |
| Voltage - Supply | 1.71 V ~ 3.465 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 208-BFQFP | |
| Supplier Device Package | 208-PQFP (28x28) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LFXP3C-3Q208I | |
| Related Links | LFXP3C, LFXP3C-3Q208I Datasheet, Lattice Semiconductor Corporation Distributor | |
![]() | LTC1728ES5-1.8#TRPBF | IC MON TRI SUPPLY 1.8V TSOT23-5 | datasheet.pdf | |
![]() | RG3216P-3323-W-T1 | RES SMD 332K OHM 0.05% 1/4W 1206 | datasheet.pdf | |
![]() | 09T1002JF | THERM NTC 10K OHM 5% 30 AWG RAD | datasheet.pdf | |
![]() | 1318332-1 | CONN SOCKET CONTACT TIN CRIMP | datasheet.pdf | |
![]() | 1589H42D1 | POWER STRIP 42" 20A 7OUT 15'C | datasheet.pdf | |
![]() | VI-J2X-EY-B1 | CONVERTER MOD DC/DC 5.2V 50W | datasheet.pdf | |
![]() | B41607A228M2 | CAP ALUM 2200UF 20% 55V SNAP | datasheet.pdf | |
![]() | PN12-8HDR-2K | TERM RING INS HEAVY DUTY | datasheet.pdf | |
![]() | HB14318000J0G | 381 TB SPR CLA W/LEVER | datasheet.pdf | |
![]() | TNPW1206106RBEEA | RES SMD 106 OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | MIC94310-JYMT-T5 | IC REG LDO 2.5V 0.2A 4TMLF | datasheet.pdf | |
![]() | 5452968 | BCVP-508WF-18 BK | datasheet.pdf |