Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-LFXP3C-3T144I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
PCN Obsolescence/ EOL | LatticeEC/P and LatticeXP Devices 25/Jul/2013 | |
Standard Package | 60 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | XP | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | 3000 | |
Total RAM Bits | 55296 | |
Number of I/O | 100 | |
Number of Gates | - | |
Voltage - Supply | 1.71 V ~ 3.465 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 144-LQFP | |
Supplier Device Package | 144-TQFP (20x20) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | LFXP3C-3T144I | |
Related Links | LFXP3C, LFXP3C-3T144I Datasheet, Lattice Semiconductor Corporation Distributor |
![]() | SL-103-G-11 | CONN RCPT .100" 3POS GOLD PCB | datasheet.pdf | |
![]() | HBC36DRTH | CONN EDGECARD 72POS DIP .100 SLD | datasheet.pdf | |
![]() | EBM02DRKN | CONN EDGECARD 4POS DIP .156 SLD | datasheet.pdf | |
![]() | MAX708TESA+ | IC SUPERVISOR MPU 8-SOIC | datasheet.pdf | |
![]() | 381LX222M080J032 | CAP ALUM 2200UF 20% 80V SNAP | datasheet.pdf | |
1550Z117 | BOX ALUM UNPAINTED 6.32"LX3.95"W | datasheet.pdf | ||
![]() | 1301.9305 | SWITCH TACTILE SPST-NO 0.05A 12V | datasheet.pdf | |
![]() | 0009522038 | Connector Receptacle, Bottom Entry 3 Position 0.156" (3.96mm) Tin Through Hole | datasheet.pdf | |
![]() | 803-87-036-10-005101 | Connector Socket 36 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | ATS-10C-134-C1-R0 | HEATSINK 70X70X15MM XCUT | datasheet.pdf | |
![]() | VJ0805D680JLXAJ | CAP CER 68PF 25V NP0 0805 | datasheet.pdf | |
![]() | EC7897-000 | HSI NARROW | datasheet.pdf |