Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LMV721IDCKR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | Create your power design now with TI’s WEBENCH® Designer | |
| PCN Design/Specification | Copper Bond Wire 07/May/2014 Copper Wire Revision A 03/Nov/2014 | |
| Standard Package | 3,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Amplifier Type | General Purpose | |
| Number of Circuits | 1 | |
| Output Type | Rail-to-Rail | |
| Slew Rate | 5.25 V/µs | |
| Gain Bandwidth Product | 10MHz | |
| -3db Bandwidth | - | |
| Current - Input Bias | 260nA | |
| Voltage - Input Offset | 80µV | |
| Current - Supply | 1.03mA | |
| Current - Output / Channel | 52.6mA | |
| Voltage - Supply, Single/Dual (±) | 2.2 V ~ 5 V | |
| Operating Temperature | -40°C ~ 105°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 5-TSSOP, SC-70-5, SOT-353 | |
| Supplier Device Package | SC-70-5 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LMV721IDCKR | |
| Related Links | LMV72, LMV721IDCKR Datasheet, Texas Instruments Distributor | |
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