NXP Semiconductors/Freescale Semiconductor, Inc. LPC1112FHN33/202,5
- Mfg. Part Number
- LPC1112FHN33/202,5
- Manufacturer
- NXP Semiconductors/Freescale Semiconductor, Inc.
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU ARM 16KB FLASH 32VQFN
- Datasheet Download
- LPC1112FHN33/202,5.pdf
Availability of LPC1112FHN33/202,5
Available Quantity
5953 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 1.16000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of LPC1112FHN33/202,5, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. LPC1112FHN33/202,5 can be shipped within 24 hours after order. If you have any demands for LPC1112FHN33/202,5, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- LPC1112FHN33/202,5 Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
LPC1112FHN33/202,5
| Internal Part Number | EIS-LPC1112FHN33/202,5 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | LPC111x,13xx Appl Note | |
| Product Training Modules | Code Density for LPC11xx | |
| Design Resources | Development Tool Selector | |
| Standard Package | 260 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | LPC1100L | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-M0 | |
| Core Size | 32-Bit | |
| Speed | 50MHz | |
| Connectivity | I²C, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, POR, WDT | |
| Number of I/O | 28 | |
| Program Memory Size | 16KB (16K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 4K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
| Data Converters | A/D 8x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 32-VQFN Exposed Pad | |
| Supplier Device Package | 32-HVQFN (7x7) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LPC1112FHN33/202,5 | |
| Related Links | LPC1112FH, LPC1112FHN33/202,5 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
LPC1112FHN33/202,5 Details Description
Related parts for LPC1112FHN33/202,5
 | RG3216V-1270-B-T1 | RES SMD 127 OHM 0.1% 1/4W 1206 | datasheet.pdf | |
 | GSC18DRES-S734 | CONN EDGECARD 36POS .100 EYELET | datasheet.pdf | |
 | SAK-XE164HM-48F80L AA | IC MCU 16BIT FLASH 100-LQFP | datasheet.pdf | |
| VE-JNK-MZ-S | CONVERTER MOD DC/DC 40V 25W | datasheet.pdf | |
| RER45F13R0MC02 | RES CHAS MNT 13 OHM 1% 10W | datasheet.pdf | |
| CA3100ER24-28S | CONN RCPT 24POS WALL MNT W/SKTS | datasheet.pdf | |
 | 110-87-640-41-001101 | CONN IC DIP SOCKET 40POS GOLD | datasheet.pdf | |
| A-DF15-LL-F-R | D-Sub Connector Receptacle, Female Sockets 15 Position Through Hole Solder | datasheet.pdf | |
 | 1N5620 | DIODE GEN PURP 800V 1A AXIAL | datasheet.pdf | |
| 581 06 30 003 | CONN 30 I/O W/O FERRITE | datasheet.pdf | |
| MKP385215063JBI2B0 | CAP FILM 0.0015UF 5% 630VDC AXIA | datasheet.pdf | |
 | OP77 | Next Generation OP07 Ultralow Offset Voltage Operational Amplifier IC | datasheet.pdf |