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NXP Semiconductors/Freescale Semiconductor, Inc. LPC1317FHN33,551

LPC1317FHN33,551 picture photo
Mfg. Part Number
LPC1317FHN33,551
Manufacturer
Product Category
Embedded - Microcontrollers
Brief Description
IC MCU ARM 64KB FLASH 33HVQFN
Datasheet Download
LPC1317FHN33,551.pdf
Availability of LPC1317FHN33,551

Available Quantity

5862 Pieces

Can ship today

Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 2.36600
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of LPC1317FHN33,551, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. LPC1317FHN33,551 can be shipped within 24 hours after order. If you have any demands for LPC1317FHN33,551, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
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Specifications of LPC1317FHN33,551
Internal Part NumberEIS-LPC1317FHN33,551
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Design ResourcesDevelopment Tool Selector
Standard Package260
Category Integrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
SeriesLPC13xx
PackagingTray
Core ProcessorARM® Cortex®-M3
Core Size32-Bit
Speed72MHz
ConnectivityI²C, Microwire, SPI, SSI, SSP, UART/USART
PeripheralsBrown-out Detect/Reset, POR, WDT
Number of I/O26
Program Memory Size64KB (64K x 8)
Program Memory TypeFLASH
EEPROM Size4K x 8
RAM Size10K x 8
Voltage - Supply (Vcc/Vdd)2 V ~ 3.6 V
Data ConvertersA/D 8x12b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C
Package / Case32-VQFN Exposed Pad
Supplier Device Package32-HVQFN (7x7)
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)LPC1317FHN33,551
Related LinksLPC1317F, LPC1317FHN33,551 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor
LPC1317FHN33,551 Details Description
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