Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LPC1833JET100E | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | SPI Flash Interface LPC Cortex-M Microcontrollers | |
| Design Resources | Development Tool Selector | |
| Standard Package | 260 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | LPC18xx | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-M3 | |
| Core Size | 32-Bit | |
| Speed | 180MHz | |
| Connectivity | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, WDT | |
| Number of I/O | 49 | |
| Program Memory Size | 512KB (512K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 16K x 8 | |
| RAM Size | 136K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.2 V ~ 3.6 V | |
| Data Converters | A/D 4x10b; D/A 1x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 105°C | |
| Package / Case | 100-TFBGA | |
| Supplier Device Package | 100-TFBGA (9x9) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LPC1833JET100E | |
| Related Links | LPC1833, LPC1833JET100E Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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