Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-LPC2364FET100,518 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | LPC2300 and LPC2400 Microcontrollers | |
| Video File | USB Overview Ethernet Overview | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | LPC2300 | |
| Packaging | Tape & Reel (TR) | |
| Core Processor | ARM7® | |
| Core Size | 16/32-Bit | |
| Speed | 72MHz | |
| Connectivity | CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB | |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | |
| Number of I/O | 70 | |
| Program Memory Size | 128KB (128K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 34K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 6x10b; D/A 1x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 100-TFBGA | |
| Supplier Device Package | 100-TFBGA (9x9) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | LPC2364FET100,518 | |
| Related Links | LPC2364F, LPC2364FET100,518 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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