Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-LPC3143FET180,551 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Design Resources | Development Tool Selector | |
Standard Package | 189 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | LPC3100 | |
Packaging | Tray | |
Core Processor | ARM9® | |
Core Size | 16/32-Bit | |
Speed | 270MHz | |
Connectivity | EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | |
Peripherals | DMA, I²S, LCD, PWM, WDT | |
Number of I/O | 20 | |
Program Memory Size | - | |
Program Memory Type | ROMless | |
EEPROM Size | - | |
RAM Size | 192K x 8 | |
Voltage - Supply (Vcc/Vdd) | 1.1 V ~ 3.6 V | |
Data Converters | A/D 4x10b | |
Oscillator Type | External | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 180-TFBGA | |
Supplier Device Package | 180-TFBGA (12x12) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | LPC3143FET180,551 | |
Related Links | LPC3143F, LPC3143FET180,551 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
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