Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M1A3P1000-2FGG256I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
Standard Package | 90 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | ProASIC3 | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | - | |
Total RAM Bits | 147456 | |
Number of I/O | 177 | |
Number of Gates | 1000000 | |
Voltage - Supply | 1.425 V ~ 1.575 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 256-LBGA | |
Supplier Device Package | 256-FPBGA (17x17) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M1A3P1000-2FGG256I | |
Related Links | M1A3P1000, M1A3P1000-2FGG256I Datasheet, Microsemi SoC Distributor |
![]() | 172-E09-212-021 | D-Sub Connector Receptacle, Female Sockets 9 Position Through Hole Solder | datasheet.pdf | |
![]() | HHR-300CHF8 | BATTERY PACK 9.6V 3100MAH NIMH | datasheet.pdf | |
![]() | CWF1B103F3380 | THERMISTOR NTC -+1% 3380K PROBE | datasheet.pdf | |
![]() | CRA06S04311K0JTA | RES ARRAY 2 RES 11K OHM 0606 | datasheet.pdf | |
![]() | 1-172052-0 | 10P MTEI RCPT HSG ASY 24 | datasheet.pdf | |
![]() | 1879669-8 | RES 1.37K OHM 1/2W 0.1% AXIAL | datasheet.pdf | |
![]() | 229XM-12BLK | MICRO HOOK-MINI ALLIG CLIP 12" | datasheet.pdf | |
![]() | VI-25P-IV-F3 | CONVERTER MOD DC/DC 13.8V 150W | datasheet.pdf | |
![]() | VI-B0B-CY-F2 | CONVERTER MOD DC/DC 95V 50W | datasheet.pdf | |
![]() | MF3MOD2101DA4/05,1 | IC SMART CARD 2K EEPROM PLLMC | datasheet.pdf | |
![]() | 09457711184 | FIELDPATCHK AWG22/72XIP200 3M | datasheet.pdf | |
![]() | FDM-2E | FUSE DISPLAY MERCHANDISER | datasheet.pdf |