Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M1A3P600-FGG144 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 110592 | |
| Number of I/O | 97 | |
| Number of Gates | 600000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 144-LBGA | |
| Supplier Device Package | 144-FPBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M1A3P600-FGG144 | |
| Related Links | M1A3P60, M1A3P600-FGG144 Datasheet, Microsemi SoC Distributor | |
![]() | 74OL6000300W | OPTOISO 5.3KV PUSH PULL 6DIP | datasheet.pdf | |
![]() | PDB-C608-1 | PHOTODIODE BLUE 38.4MM SQ BARE | datasheet.pdf | |
![]() | PDL-5859-1 | LABEL S LAM DM VNL WHT 1.13X3.75 | datasheet.pdf | |
![]() | ECW-HA3C562J | CAP FILM 5600PF 5% 1.6KVDC RAD | datasheet.pdf | |
![]() | RN55E3321BB14 | RES 3.32K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | 612-83-424-41-001101 | CONN IC DIP SOCKET 24POS GOLD | datasheet.pdf | |
| 503HAB-ACAG | OSC PROG 0.7NS 50PPM 2.5X3.2MM | datasheet.pdf | ||
![]() | Y07861K00000V0L | RES 1K OHM 0.6W 0.005% RADIAL | datasheet.pdf | |
![]() | ATS-07H-140-C1-R0 | HEATSINK 25X25X25MM L-TAB | datasheet.pdf | |
![]() | ATS-20C-172-C3-R0 | HEATSINK 30X30X25MM R-TAB T412 | datasheet.pdf | |
| IS42S32160B-6TLI | IC SDRAM 512M 143MHZ 86TSOP | datasheet.pdf | ||
![]() | MMA0204MC4703FB300 | RES SMD 470K OHM 1% 0.4W MELF | datasheet.pdf |