Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M1A3P600L-FG144 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3L | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 110592 | |
| Number of I/O | 177 | |
| Number of Gates | 600000 | |
| Voltage - Supply | 1.14V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 144-LBGA | |
| Supplier Device Package | 144-FPBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M1A3P600L-FG144 | |
| Related Links | M1A3P60, M1A3P600L-FG144 Datasheet, Microsemi SoC Distributor | |
![]() | 9T04021A8202FBHF3 | RES SMD 82K OHM 1% 1/16W 0402 | datasheet.pdf | |
![]() | ERJ-S1DF5620U | RES SMD 562 OHM 1% 3/4W 2010 | datasheet.pdf | |
![]() | RG1005N-7871-B-T5 | RES SMD 7.87KOHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | GSM15DTMS | CONN EDGECARD 30POS R/A .156 SLD | datasheet.pdf | |
![]() | 573100D00010G | HEATSINK SMT D-PAK/TO-252 TIN | datasheet.pdf | |
![]() | 63YXM47MEFCT78X11.5 | CAP ALUM 47UF 20% 63V RADIAL | datasheet.pdf | |
![]() | 803-87-006-30-480191 | Connector Socket 6 Position 0.100" (2.54mm) Gold Surface Mount | datasheet.pdf | |
![]() | 91615-424ALF | DUBOX | datasheet.pdf | |
![]() | ATS-11G-52-C3-R0 | HEATSINK 30X30X25MM L-TAB T412 | datasheet.pdf | |
![]() | BFC238553333 | CAP FILM 0.033 UF 5 % 1600 VDC R | datasheet.pdf | |
![]() | D38999/26TG11JN-LC | TV 11C 11#12 SKT PLUG | datasheet.pdf | |
![]() | GTC06R36-77S | GT 7C 7#4 SKT PLUG | datasheet.pdf |