Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M1AFS1500-2FG484 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | DDR Frequency 25/Jan/2013 | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Fusion® | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 276480 | |
| Number of I/O | 223 | |
| Number of Gates | 1500000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M1AFS1500-2FG484 | |
| Related Links | M1AFS150, M1AFS1500-2FG484 Datasheet, Microsemi SoC Distributor | |
![]() | TMM-118-01-T-S | CONN HEADER 18POS SNGL 2MM T/H | datasheet.pdf | |
![]() | RMCF0603FT9K10 | RES SMD 9.1K OHM 1% 1/10W 0603 | datasheet.pdf | |
![]() | 1-1634224-2 | D-Sub Connector Receptacle, Female Sockets 25 Position Through Hole Solder | datasheet.pdf | |
![]() | CB5442-000 | HEAT SHRINK TUBING | datasheet.pdf | |
![]() | GRM1556T1H1R4CD01D | CAP CER 1.4PF 50V T2H 0402 | datasheet.pdf | |
![]() | SMA6F5.0A-TP | TVS DIODE 5VWM 9.2VC DO221AC | datasheet.pdf | |
![]() | VE-J4X-EW-F3 | CONVERTER MOD DC/DC 5.2V 100W | datasheet.pdf | |
![]() | AS1328C-BQFT-AD | IC REG BUCK ADJ 3A SYNC 16-TQFN | datasheet.pdf | |
![]() | RN60C5111BB14 | RES 5.11K OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | M55342E02B100EPWS | RES SMD 100K OHM 1% 1/8W 0505 | datasheet.pdf | |
![]() | 3094-821GS | FIXED IND 820NH 400MA 300 MOHM | datasheet.pdf | |
![]() | 20020009-D201B01LF | TERM BLOCK | datasheet.pdf |